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DFL7362FHFully Automatic Laser Saw

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FAQ

A laser saw dedicated for frame transfer that achieves high‑speed, high‑quality processing of ultra‑thin Si

Φ300 mm
Stealth Dicing™
SDTT

Si with a thickness of 50 µm or less can be singulated at high speed while maintaining high die strength.
In addition to silicon, DFL7362FH also supports processing of transparent materials.
DFL7362FH is compatible with a wide range of options related to quality and productivity, such as wafer thickness measurement and non-stop kerf check.

High throughput

Compared to existing equipment dedicated for frame transfer, the UPH has been improved by approx. 30 % through a higher maximum X-axis speed and acceleration in addition to reduced time required for transfer and alignment.

Example applications

As DFL7362FH is an equipment dedicated for frame transfer, it supports singulation of ultra-thin Si after backgrinding using the SDAG (Stealth Dicing After Grinding) process. In addition, for workpieces where irradiation from the top side is difficult, adding an automatic frame-flip mechanism makes the SDTT (Stealth Dicing Through Tape) process possible, enabling stealth dicing through tape.

DISCO is an alliance partner^* of Hamamatsu Photonics, which owns the portfolio of patents for Stealth Dicing technology.

*System integrators who are business partners with comprehensive licensing for the portfolio of patents for Hamamatsu Stealth Dicing technology.
https://www.hamamatsu.com/jp/en/product/semiconductor-manufacturing-support-systems/stealth-dicing-technology/alliance-partners.html

Specifications

Specifications		Unit	DFL7362FH
Processing method		-	Stealth Dicing™
Max. workpiece size		mm	Φ300
X axis (Chuck table)	Cutting range	mm	310
X axis (Chuck table)	Cutting speed range	mm/s	1 to 2,000
Y axis (Chuck table)	Cutting range	mm	310
	Index step	mm	0.0001
	Positioning accuracy	mm	0.003/310 (Single pitch error) 0.002 or smaller/5
Z axis	Movement resolution	mm	0.000005
Z axis	Repeatability accuracy	mm	0.001
θ axis (Chuck table)	Max. rotation angle	deg	380
Equipment dimensions (W×D×H)		mm	1,100 × 2,100 × 1,990
Equipment weight		kg	Approx.2,350

* Please read the standard specification sheet before using the equipment.
* Please note that items and specifications may be changed for improvement without prior notice.

Product Lineup



Machine type
Method
Machine dimentions（W × D × H）
Machine weight（kg）


DFL7341	DFL7362
Fully Automatic	Fully Automatic
Stealth Dicing™	Stealth Dicing™
950 × 1,732 × 1,800	1,600 × 2,755 × 1,800
1,800	2,850

Equipment models that support Stealth Dicing are equipped with an SD engine, which has a modularized laser and optical system developed by Hamamatsu Photonics for DISCO.