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DFL7262Fully Automatic Laser Saw

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FAQ

A standard laser saw model with an ultrashort-pulse laser

Φ300 mm
Ablation

DFL7262 is a fully automatic laser saw for Φ300 mm wafers.
An ultrashort-pulse laser head and optical system can be installed.
It automatically performs the entire series of processes, from HogoMax* coating, through dicing, to cleaning.
By separating the HogoMax coating and cleaning sections, productivity can be improved.

*HogoMax：A water-soluble protective film that prevents laser processing particles from adhering to the wafer surface

Grooving process for low-k wiring layer

Processing is possible while minimizing heat damage using the ultrashort-pulse laser

Low-k wiring layer grooving

Full-cut processing of composite structures

Achieves high-quality processing of composite structures including Si wafers with DAF and Si/Mold

Si/DAF grooving

Wafer transfer and tape frame transfer

Transfer method can be switched easily by performing replacement of some parts and size conversion

［Tape frame transfer］Processing of wafers after grinding
［Wafer transfer］Processing of wafers before grinding

Processing Examples

Wiring layer removal for logic devices (tape frame transfer)

Wiring layer removal for high bandwidth memory (HBM) devices (tape frame transfer)

Pattern and/or wiring layer removal for NAND/DRAM memory devices (wafer transfer)

Specifications

Specifications		Unit	DFL7262
Max. workpiece size		mm	Φ300
X axis (chuck table)	Cutting range	mm	310
X axis (chuck table)	Cutting speed range	mm/s	1 to 1,000
Y axis (chuck table)	Cutting range	mm	310
	Index step	mm	0.0001
	Positioning accuracy	mm	0.003 or smaller/310 (Single pitch error) 0.002 or smaller/5
Z axis	Movement resolution	mm	0.00002
Z axis	Repeatability accuracy	mm	0.002
θ axis (Chuck table)	Max. rotation angle	deg	330 (standard) 380 (option)
Equipment dimensions (W×D×H)		mm	1,560 × 1,680 × 1,800
Equipment weight		kg	Approx. 2,360

* Please read the standard specification sheet before using the equipment.
* Please note that items and specifications may be changed for improvement without prior notice.
* HogoMax is a registered trademark of DISCO CORPORATION in Japan and other countries.

Product Lineup



Machine type
Method
Machine dimentions（W × D × H）
Machine weight（kg）


DFL7160	DFL7161	DFL7360LF
Fully Automatic	Fully Automatic	Fully Automatic
Ablation	Ablation	Ablation
1,200 × 1,550 × 1,800	1,560 × 1,550 × 1,800	1,100 × 2,245 × 1,800
1,750	2,300	2,250