DFL7562Fully Automatic Laser Saw

A multi-purpose laser saw that can be equipped with a wide range of laser oscillators and optical systems

Φ300 mm
Ablation

DFL7562 is a fully automatic laser saw that supports Φ300 mm wafers.
It is possible to select between various optical systems, such as a fixed optical system*¹ or a scanning optical system*².
It automatically performs the entire series of processes, from HogoMax^®*³ coating, through dicing, to cleaning.
By separating the HogoMax coating and cleaning sections, productivity can be improved.

*¹ Processing by passing the laser beam through a fixed focusing lens.
*² Processing while scanning the laser beam.
*³ A water-soluble protective film that prevents laser processing particles from adhering to the wafer surface.

Processing using a fixed optical system

Grooving of low-k interconnect and patterned layers
Full-cut of Si or compound semiconductor wafers
(Including Si, GaAs, SiC, InP, metal substrates)

GaAs 100 μm thick

Si 100 μm thick

SiC 50 μm thick

InP 150 μm thick

Processing using a scanning optical system

Grooving of low-k interconnect and patterned layers
(Maximum grooving width: 330 μm)
Processing to create tapered or rounded profiles

Narrow width grooving

Rounded profile

330 μm grooving width

Specifications

Specification		Unit	DFL7562
Max. workpiece size		mm	Φ300
X axis (Chuck table)	Cutting range	mm	310
X axis (Chuck table)	Cutting speed range	mm/s	1 to 1000
Y axis (Chuck table)	Cutting range	mm	310
	Index step	mm	0.0001
	Positioning accuracy	mm	0.003 or smaller/310 (Single pitch error) 0.002 or smaller/5
Z axis	Movement resolution	mm	0.000015
Z axis	Repeatability accuracy	mm	0.002
θ axis (Chuck table)	Max. rotation angle	deg	380
Equipment dimensions (W×D×H）		mm	1,850 × 1,680 × 1,800
Equipment weight		kg	Approx. 2,850

Note:
* Please read the standard specification sheet before using the equipment.
* Please note that items and specifications may be changed for improvement without prior notice.
* HogoMax is a registered trademark of DISCO CORPORATION in Japan and other countries.

Product Lineup



Machine type
Method
Machine dimentions（W × D × H）
Machine weight（kg）


DFL7160	DFL7161	DFL7262	DFL7360LF
Fully Automatic	Fully Automatic	Fully Automatic	Fully Automatic
Ablation	Ablation	Ablation	Ablation
1200 × 1550 × 1800	1560 × 1550 × 1800	1560 × 1680 × 1800	1100 × 2245 × 1800
1750	2300	2360	2250