*A water-soluble protective film that prevents laser processing particles from adhering to the wafer surface
Achieves high-quality processing with less processing distortion and deformation due to heating.
DFL7160 also supports applications for removing TEG on low-k grooves or streets and performing full cut for Si and compound semiconductors.
Automatically checks and adjusts the laser cut position. This function is installed as a standard specification, making it possible to achieve stable processing.
|Max. workpiece size||mm||Φ300|
|Moving speed||mm/s||0.1 ～ 600|
(Single error) 0.002/5
|Max. rotating angle||deg||380|
|Machine dimensions (W×D×H)||mm||1,200 × 1,550 × 1,800|
|Machine weight||kg||Approx. 1,750|
*Product appearance, features, specifications, and other details may change due to technical
*Please read the standard specification sheet thoroughly before use.