DFL7341LFFully Automatic Laser Saw

A laser saw that uses the LEAF process to achieve processing of thick materials up to Φ8 inches in size

Φ200 mm
Ablation

DFL7341LF is a fully automatic laser saw that supports the LEAF* process by utilizing laser ablation.
*LEAF (Laser Enhanced Ablation Filling)
It achieves separation of thick materials and narrow kerfs through high-aspect-ratio processing.
It also supports processing of difficult-to-process materials, such as diamond, glass, and sapphire.

Thick material processing

Supports processing of materials up to 1 mm thick as a standard specification, and up to 10 mm in thickness upon request (user-specified specification).

Processing examples

Specifications

Specification		Unit	DFL7341LF
Processing method		-	LEAF
Max. workpiece size		mm	Φ200
X axis (Chuck table)	Cutting range	mm	210
X axis (Chuck table)	Cutting speed range	mm/s	1.0 - 1,000
Y axis (Chuck table)	Cutting range	mm	210
	Index step	mm	0.0001
	Positioning accuracy	mm	0.003 or smaller/210 (Single pitch error) 0.002 or smaller/5
Z axis	Movement resolution	mm	0.0001
Z axis	Repeatability accuracy	mm	0.001
θ axis (Chuck table)	Max. rotation speed	deg	380
Equipment dimensions (W×D×H)		mm	950 × 1,732 × 1,800
Equipment weight		kg	Approx. 1,820

* Please read the standard specification sheet before using the equipment.
* Please note that items and specifications may be changed for improvement without prior notice.

Product Lineup



Equipment type
Method
Dimensions（W × D × H）
Weight（kg）


DFL7160	DFL7161	DFL7262	DFL7360LF	DFL7562
Fully Automatic	Fully Automatic	Fully Automatic	Fully Automatic	Fully Automatic
Ablation	Ablation	Ablation	Ablation	Ablation
1200 × 1550 × 1800	1560 × 1550 × 1800	1560 × 1680 × 1800	1100 × 2245 × 1800	1850 × 1680 × 1800
1750	2300	2360	2250	2850