The DISCO surface planer provides solutions for high-precision planarization of ductile materials such as metals, resins, and their composites as well as solutions for reducing bump height variation and surface roughness.
See here for processing examples.
|Supported workpiece size||-||Φ8 inch|
|Number of spindles||-||1|
|Number of chuck tables||-||1|
|Process precision||TTV||µm||Less than 2.0|
|5 x 5 mm die bump height variation||µm||Less than 1.0|
|surface roughness||µm||Within Ra 0.02|
|Equipment dimensions (W × D × H)||mm||1,200 x 2,670 x 1,800|
*Product appearance, features, specifications, and other details may change due to technical
*Please read the standard specification sheet thoroughly before use.