"Stealth Dicing™ process" forms a modified layer in the workpiece by focusing a laser inside the workpiece, and then a tape expander is used to separate the die.
Before tape expansion
After tape expansion
The profile of a MEMS die, such as one with a hollowed structure, or one that is already embedded with complicated minute elements, is generally not strong enough for cleaning water or the dicing load. Stealth dicing can be expected to result in high-quality processing of MEMS because it does not use water for processing or cleaning, and there is little or no damage to the die front or back surfaces.
Stealth Dicing™ process is expected to increasethe number of die that can be obtained from a wafer compared to normal dicing because it is possible to make the necessary street width (cut width) narrower. This is a particularly effective processing method for long shaped die, such as line sensors.
The number of die obtained from one wafer increases by reducing the street width on a wafer with long-shaped dies.
A Hasen Cut is a method that cuts while repetitively turning the laser ON/OFF at a set cycle during laser processing. It is possible to process various shapes depending on the ON/OFF setting.
By using the Hasen Cut, it is possible to process a wafer with combinations of irregular die shapes that could not be realized with the existing laser full cut processing or a blade dicer.
This cutting method can efficiently process workpieces like polygon shaped die, such as hexagons and octagons. Depending on the conditions, it is also be possible to process irregular shaped die.
By applying the Hasen Cut, the dicing street can also support intermittent die layout, as shown in the illustration below. This is effectively useful for large die sizes, high-priced wafers or long die, and enables increasing the number of die that can be obtained.
Die separators separate wafers with SD layers into die through dicing tape expansion. After the SD process, the wafer is separated into die using tape expansion in the expansion stage. Then, tape outer sag is eliminated by shrinking the tape using temperatures higher than 200 deg. C (heat shrink) in the heat expansion stage. By doing so, it is possible to transfer wafers to the next process on the tape frame without re-mounting the tape.
A free-of-charge test cut is performed at an application lab to confirm whether achieving the customer's needs is possible.
Dicing and Grinding Service
It is effective in sample and prototype manufacturing during development or low-volume production. Designated engineers will provide support based on the desired leadtime and at reasonable cost.