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Corporate Outline

Low-k Grooving

Solution

The mechanical strength of low-K film used as insulating film for high-speed logic is low, and thus, there is the risk of film peeling when the normal blade dicing process is used. The low-K grooving process removes the wiring layer, including the low-K film, using laser grooving equipment.

Application

Laser grooving process

First, the DFL7161 rapidly makes two laser grooves in the dicing street - either "Pi Laser Grooving" or "Omega Laser Grooving"; then the wafer is blade-diced at standard speed. This application achieves excellent throughput yet greatly reduces or eliminates chipping, delamination and other cut-quality issues.

Pi (π) laser grooving(Step cut blade dicing)

Pi (π) laser grooving(Step cut blade dicing)

Movie

Omega (ω) laser grooving(One pass blade dicing)

Omega (ω) laser grooving(One pass blade dicing)

Movie

Application Example

  • Cross sectional view of dicing street

    Pi (π) laser grooving followed by step cut blade dicing.

    Cross sectional view of dicing street
  • Magnification of Low-k layer & metal circuits

    Little or no chipping and delamination.

    Magnification of Low-k layer & metal circuits

Equipment

Precision and Ease of Use

The DFL7161 (300 mm compatible) Fully Automatic Laser Saw utilizes short pulse laser technology to groove the streets of Low-k and Cu wafers with little or no heat damage. An LCD touch screen graphical user interface allows for excellent ease of operation.

Laser process

Laser process

Laser

Cutting Quality

The DFL7161 focuses a short pulse UV laser on the surface of the wafer. Each pulse is absorbed by the Low-k material. After successive laser pulses, sufficient energy is absorbed to cause the Low-k material to vaporize. The vaporized material carries away the energy from the interaction, thereby minimizing heat transfer to the surrounding material.

Cutting Quality

Contact

Please feel free to contact us with any questions or inquiries.

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