The DGP8761 is the successor to the DGP8760, which is used by premier manufacturers worldwide. It integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm. The DGP8761 is equipped with a newly developed spindle to support high-speed grinding. This contributes to a shorter thin wafer processing time (compared to the DGP8760). In addition, an optimized handling layout shortens the cycle time (not including processing time).
The following Z3 spindle configurations for thin wafer processing can be selected:
Super fine grinding (optional)
*Gettering: a process which forms a minute destructive layer (gettering sites) inside the silicon wafer. Impurities, such as heavy metals, present in the wafer are captured at these gettering sites.
This is a solution which realizes high die strength and maintains the gettering effect by using DISCO’s unique dry polishing.
Grinding wheel "UltraPoligrind"
The newly developed UltraPoligrind wheel, which uses micro-abrasives, can process thin wafers without chemicals. The wheel can achieve high wafer strength which cannot be obtained with traditional grinding wheels, while maintaining the grinding gettering effect (Extrinsic Gettering).
By integrating the DGP8761 with a multi-wafer mounter, DFM2800, it is possible to support the attachment of DAF (Die Attach Film) for thin wafers. It can also be used in an inline configuration with DISCO's DBG (Dicing Before Grinding) process.
The DGP8761 is compatible with grinding wheels, polishing wheels, dresser boards and other parts designed for existing DISCO 8000 Series equipment. In addition, the operation method and GUI (Graphical User Interface) are based on proven 8000 Series technology.
|Supported workpiece size||mm||Φ300（Φ200 / Φ300）|
|Grinding Method (Z1/Z2 axis)||-||In-feed grinding with wafer rotation|
|Grinding Method (Z3 axis)||-||Anomalous in-feed grinding with wafer rotation|
|Grinding Wheels||-||Φ300 mm Diamond wheel (grinding-axis)
Φ450 mm Dry polishing pad (DP-axis)
Φ450 mm CMP pad (CMP-axis）
|Equipment dimensions (W×D×H)||mm||1,690 × 3,315 × 1,800 (open cassette)
1,690 × 3,452 × 1,800 （FOUP）
|Equipment weight||kg||Approx. 6,700(DP, Poligrind)
Approx. 6,900 (CMP)
*Product appearance, features, specifications, and other details may change due to technical
*Please read the standard specification sheet thoroughly before use.
|Machine dimentions（W × D × H）|
|Automatic||Fully Automatic||Fully Automatic||Fully Automatic||Fully Automatic||Fully Automatic||Fully Automatic||Fully Automatic||Fully Automatic|
|600 × 1,700 × 1,780||800 × 2,450 × 1,800||1,200 × 2,670 × 1,800||1,400 × 3,190 × 1,800||1,000 × 2,800 × 1,800||1,400 × 2,500 × 2,000||1,200 × 2,670 × 1,800||900 × 2,584 × 2,000||1,400 × 3,322 × 1,800|