DME8061Fully Automatic MUSUBI Dry Etcher

A MUSUBI dry etcher that achieves improved die strength

Φ300 mm
DBG
SDBG
Wafer Thinning
Stress Releaf
Gettering

Achieves improved die strength by using plasma stress relief

DME8061 is a dry etcher that can achieve non-contact stress relief using plasma.
Improved die strength can be achieved by removing the damaged layer that remains after grinding.

Prevents metal contamination using plasma gettering

It is possible to switch the processing gas after performing stress relief so that the gettering process* can be performed consecutively.
Metal contamination of the device surface is suppressed by forming a gettering layer on the ground surface.

*Gettering: a mechanism that captures and retains impurities such as heavy metals to suppress their impact on device characteristics.

dme8061 — *DMM9200 is a part of the MUSUBI.

Can be used as part of MUSUBI

DME8061 is compatible with MUSUBI, a cluster system that connects multiple equipment units. MUSUBI enables selection of an equipment combination that is suitable for the customer’s manufacturing process. As transfer within the equipment is automated, it is possible to achieve wafer breakage risk reduction and improved throughput.

Example of process with equipment connected through MUSUBI_002:

DMG8762 (grinder/polisher) + DME8061 (dry etcher) + DMM9200 (wafer mounter)

By implementing the plasma stress relief and plasma gettering processes for the die surface using DME8061 after the SDBG® (Stealth Dicing Before Grinding) process, it is possible to achieve both improved die strength and a gettering effect.

Workflow

Workpiece is received from the grinder/polisher.
Robot transfers the workpiece to the drying table.
Workpiece is dried.
Workpiece is transferred to the chuck table inside the chamber using the transfer arm.
Plasma stress relief and gettering processes are performed.
Workpiece is transferred to the positioning table using the transfer arm.
Robot receives and transfers the workpiece to the mounter.

Specifications

Specification	Unit	DME8061
Supported workpiece size	mm	Φ300
Processing gas	-	SF6, Ar
Equipment dimensions (W×D×H)	mm	1,400 × 2,200 × 1,800
Equipment weight	kg	Approx. 2,600

* Customer must prepare a gas abatement system.
* Please read the standard specification sheet before using the equipment.
* Please note that items and specifications may be changed for improvement without prior notice.

Product Lineup



Machine type
Spindle
C/T
Machine dimentions（W × D × H）
Machine weight（kg）


DFP8140	DFP8141	DFP8160	DGP8761	DGP8762
Fully Automatic	Fully Automatic	Fully Automatic	Fully Automatic	Fully Automatic
1	1	1	3	3
1	2	1	4	4
1,200 × 2,670 × 1,800	900 × 2,584 × 2,000	1,400 × 3,322 × 1,800	1,690 × 3,315 × 1,800	1,690 × 3,451 × 1,800
1,900	3,100	2,400	6,700	6,850