Smartphones and tablets are continually becoming thinner and supporting a higher processing capacity,
which means that flash memory and memory controller chips must also become thinner. Current processes are
focused on reducing chipping and improving thin wafer handling.
The SDBG process not only addresses these issues but also makes the following possible:
SDBG is the process of performing backside grinding after Stealth Dicing™ process. It produces narrow streets on
thin die and improves die strength.
Using a die separator (DDS Series) after SDBG, it is possible to precisely separate the DAF (die attach film) which is used as a bonding material when laminating thin die.
Kerfs generated during Stealth Dicing™ process are extremely narrow. Thus, Stealth Dicing™ process contributes to producing narrower streets. It is expected to increase the number of die yielded from each wafer compared to the conventional dicing process.
In conventional blade dicing, front and backside chipping and processing marks remaining on the side wall
can affect die strength.
In the SDBG process, die separation is performed at the modified section using Stealth Dicing™ process as its starting point, and the modified section is removed during backside grinding. Thus, it is possible to reduce front and backside chipping and produce thin die with a high die strength.
By expanding DAF using the die separator (DDS Series) in a low temperature environment, it is possible
to achieve high quality separation.
Dicing tape sag after expansion is eliminated using heat shrink, making it possible to transfer the die to the next die bonding process without re-laminating the dicing tape.
Products for SDBG process
A free-of-charge test cut is performed at an application lab to confirm whether achieving the customer's needs is possible.
Dicing and Grinding Service
It is effective in sample and prototype manufacturing during development or low-volume production. Designated engineers will provide support based on the desired leadtime and at reasonable cost.