This dry polisher can remove grinding damage layer on the backsides of wafers up to Φ300 mm without slurry. This process greatly reduces wafer breakage and warpage and improves die strength and product yield. In addition, it contributes to reducing environmental impact.
DFP8160’s design allows it to be integrated or retrofitted with DISCO grinders. Safer wafer transferring can be achieved when installed inline with DFG8560 (option).
The dry polishing process does not require chemical processing through wet etching or CMP. Dry polishing with DFP8140 is environmentally friendly while maintaining a lower cost of ownership than other stress relief processes.
Installation of a touch screen and GUI (Graphical User Interface) provides improved operability. In addition, processing and equipment status are displayed on-screen and each operation can be performed just by touching the icons. Thus, high operability during processing and maintenance is achieved.
|Wafer Diameter||-||Φ200, 300 mm (Select one size)|
|Polishing Method||-||Anomalous In-feed grinding with wafer rotation|
|Wheel||-||Φ450 mm Dry Polishing Wheel|
|Chuck table type||-||Porous chuck table|
|Number of revolutions||min‐1||0 ～ 300|
|Chuck table cleaning||-||Water & air thrust up, Leveling stone and brush cleaning|
|Spindle||Output||kW||7.5||Revolution speed range||min‐1||1,000 ～ 3,000|
|Internal load sensor||-||Thin force sensor|
|Spinner unit||-||Wafer washing and drying by atomizing nozzle|
|Machine dimensions (W×D×H)||mm||1,400 × 3,322 × 1,800|
*Product appearance, features, specifications, and other details may change due to technical
*Please read the standard specification sheet thoroughly before use.