The DFP8141 is a fully automatic polisher which performs CMP processing from cassette to cassette. With the installation of a cleaning station, wafer cleaning and drying after processing are performed automatically.
The DFP8141 supports CMP for materials such as sapphire, SiC, LT, and LN.
The transfer system accepts three workpiece configurations: single wafer transfer, substrate transfer, and frame transfer.
|Wafer diameter||-||Φ8 inch|
|Polishing wheel||-||Φ300 mm CMP pad|
|Spindle||Rated output||kW||7.5||Revolution speed||min‐1||500 ～ 2,000|
|Machine dimensions (W x D x H)||mm||900 x 2,584 x 2,000|
*Product appearance, features, specifications, and other details may change due to technical
*Please read the standard specification sheet thoroughly before use.