Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc.), Oxide wafers (LiTaO3, etc.), etc
The ZH14 series provides improved blade rigidity to realize stable processing without slanted cutting even under high load conditions, which includes processing applications requiring high speed, deep cutting, and long blade exposure. In addition, for narrow street and high revolution speed processing, improvements in the blade breakage speed limit* and wavy cutting can be expected.
*The maximum cutting speed before blade breakage occurs.
Compared to existing blades, it can be seen that the ZH14 series can process with less slanted and wavy cutting.
* For this evaluation, a thin blade with long blade exposure was fabricated to simulate conditions where processing defects are likely to occur.
|Workpiece||Si (thickness: 2 mm)|
|Feed speed||110 mm/s|
|Spindle revolution||30,000 min-1|
In a test to measure the blade breakage speed limit as the processing speed is increased, it was observed that the breakage speed limit was improved by approximately 20% compared to existing blades.
|Depth||725 μm (full cut)|
|Spindle revolution||35,000 min-1|
Please contact a DISCO representative with your product needs such as type, wheel size, and quantity.
When you place the first order with us, please explain application information such as materials to grind, sizes, machine, type, and other specification.
We are ready to help you to determine which is our most appropriate product type for your application.
* Due to improvements in our products, it is possible that product specifications may be changed without advanced notice.
Please confirm the product specifications with a DISCO representative.
To use these DISCO blades and wheels (hereafter precision tooling) safely
Please read carefully and follow the instructions below to prevent any accidents or injuries.