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ZHDG Series

ZHDG Series
The ZHDG series developed for dicing various substrates adopts a larger grit size compared to the hub blades for semiconductor wafers. Also, the abundant concentration lineup responds to various customer requests.

  • Improved operability thanks to the aluminum base as compared with standard hubless type blades for dicing substrates.
  • Selectable from a lineup with an abundant variety of grit sizes and concentrations.
  • Reduction in resin/metal burring by selecting a low concentration.
Catalog Download
For the detailed specification and functions, view our catalogues.
ZHDG Series Catalog
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