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NBC-Z Series

NBC-Z Series
The ultra-thin, high-performance NBC-Z series blades are a result of DISCO's original blade development.
These blades employ electroformed bonds that realize superb cutting quality and blade life.
In addition to dicing semiconductor wafers, these blades are suitable for dicing a wide variety of semiconductor packages.

  • Deep cutting and grooving are possible using ultra-thin blades.
  • Blade thickness - 0.015 mm to 0.3 mm
  • Wide range of grit sizes and bond types are available to meet application requirements
  • Available for both dicing saws and slicers
Catalog Download
For the detailed specification and functions, view our catalogues.
NBC-Z Series Catalog
If you have any questions or need to discuss something, please feel free to contact us.
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