For relatively thick blades in excess of 60 µm, only the blade tip midsection may wear as the number of cut lines increase. This blade tip shape collapse causes quality deterioration such as widening of the kerf and sporadic chipping. The ZHCR series restrains the collapse of the blade tip shape and realizes stable processing without deterioration using a special blade structure based on
unique technology. The ZHCR series proves its worth in the following processes where blade tip shape collapse easily occurs.
Processes that use blades with thicknesses exceeding 60 µm
Processing of wafers with a lot of TEG on the street
Blade dicing after laser grooving
For the detailed specification and functions, view our catalogues.