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Z05 Series

Z05 Series
The Z05 Series electroformed bond blades employ new DISCO advances in materials and manufacturing process. The result of two types of ultra-high-performance blades handles hard and brittle materials, resin circuit boards and many semiconductor device packages.

  • Up to 6 concentration levels provide a greater blade selection.
  • In processing hard and brittle materials, process quality is improved while blade life is maintained.
  • Blade edge retains shape for stable and consistent processing.
  • Burring of metal and plastic may be prevented or reduced.
Catalog Download
For the detailed specification and functions, view our catalogues.
Z05 Series Catalog
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