In separation process for thin wafers with DAF (Die Attach Film), there are issues such as DAF burring forming on the cut surface when full-cut dicing is performed and pickup errors during die bonding. Using the DDS2300 in the dicing process improves DAF cut quality and provides solutions for these issues.
When using DAF together with the DBG (Dicing Before Grinding) process, which is suited for thin die manufacturing, it is necessary to attach a DAF to the backside of the separated dies and dice the DAF only. The existing laser process for dicing DAF only sometimes requires consumables such as a surface protective film solution. By using the DDS2300, it is possible to reduce the amount of DAF cut by laser, which reduces cutting debris and contributes to reduced consumable costs.
The DDS2300 produces stable die separation of wafers which contain a modified layer formed through Stealth Dicing™ process. This process is particularly effective after Stealth Dicing™ process has been applied to thin wafers with DAF.
The cool expansion method is used to achieve stable DAF cleaving. Using the characteristics of DAF where it becomes brittle at low temperatures, expansion is performed in a low temperature environment to realize high precision DAF separation.
The sagging that occurs around the periphery of the dicing tape after expansion can be eliminated through heat shrinking. This enables the workpiece to be transported to the following die bonding process, while it is still mounted on a tape frame and eliminates the need to replace the tape.
|Max. workpiece size||mm||Φ300|
|Cooler stage||Temperature setting range||℃||0 or -5 (fixed)
(setting when shipped from the Plant)
|Max. upthrust amount||mm||30|
|Upthrust amount setting range||mm||0 ～ 30 (step 0.001)|
|Max. upthrust speed||mm/s||400|
|Upthrust speed setting range||mm/s||0.001 ～ 400 (step 0.001)|
|Heat shrink stage||Hot air temperature setting range||℃||200 or 220 or 250 (selective)|
|Max. upthrust amount||mm||20|
|Upthrust amount setting range||mm||0 ～ 20 (step 0.001)|
|Max. up thrust speed||mm/s||50|
|Upthrust speed setting range||mm/s||0.001 ～ 50 (step 0.001)|
|Machine dimensions (W×D×H)||mm||1,200 × 1,550 × 1,800|
*Product appearance, features, specifications, and other details may change due to technical
*Please read the standard specification sheet thoroughly before use.