Achieves improved wafer separation yield

DDS2020 achieves stable die separation of wafers where a modified layer has been created inside the wafer using the Stealth Dicing™ process. DDS2020 also supports separation following processes such as laser grooving and blade half-cut.

DDS2020 is equipped with a unique breaking mechanism where the wafer is secured by upper and lower clamp bars, and separation is performed by pushing down a breaking bar. Therefore, high-quality separation is possible for wafers that are difficult to separate through just tape expansion.