Japanese Chinese Traditional Chinese Simplified Korean English
About DISCO Investors CSR
HomeNews ReleasesSolutionsProduct InformationCustomer SupportCustomer SatisfactionContact
DISCO HOME > Product Information > Dry Polishing Wheels > DP08 Series

Product Information

DP08 Series

DP08 Series
The DP08 series enables polishing of ultra-thin wafers with DISCO's unique dry polishing process. In addition to having a low environmental impact by not using chemicals, it achieves high die strength and is simple to operate compared to a process that uses slurry.

  • Low environmental impact due to the process requiring no slurry
  • High die strength thanks to the original dry polishing process
Catalog Download
For the detailed specification and functions, view our catalogues.
DP08 Series Catalog (PDF:456KB)
If you have any questions or need to discuss something, please feel free to contact us.
Contact form Check your nearest DISCO sales office

Back To Top

Product Information
Precision Machines
Precision Processing Tools
Other Products

KABRA Used semiconductor equipment
Trade Show Information

Personal Information Protection Policy
User Agreement
Use of the DISCO Corporate Name
Guarantee policy for customer using DISCO Products
Back To Top