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Gettering DP

Gettering DP
In accordance with ultrathinning of wafers, a decline in gettering performance becomes a major concern. Gettering DP is a new solution which realizes high die strength and good gettering performance at the same time using DISCO's unique dry polishing process. This chemical-free process has less environmental impact and polishes thin wafers by operations easier than the process using slurry.

  • Realizes gettering performance equal to the normal grinding
  • Low environmental impact due to the process requiring no slurry
  • High die strength thanks to the original dry polishing process
Catalog Download
For the detailed specification and functions, view our catalogues.
Gettering DP Catalog (PDF:544KB)
If you have any questions or need to discuss something, please feel free to contact us.
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