DFG8560 is the successor to the DFG800 series, equipment used by premier manufacturers worldwide. Equipment weight has been reduced by 1.0 t (20% less than DFG860) while maintaining the same basic specifications and performance level as the 800 series.
Advanced handling systems and design features facilitate high yield for thin wafer grinding.
The DFG8560 can be integrated with DISCO's Dicing Before Grinding (DBG) system as well as polishers (DFP8160) for in-line processing solutions.
More stable Z2-axis grindability is achieved by matching the Z1 and Z2-axis grinding points. This reduces total thickness variation on the wafer as well as wafer to wafer thickness variation, contributing to more stable thinning quality.
Grinding wheels, dresser boards, spindles, and chuck tables for the existing 800 series are also compatible with DFG8560.
Installation of a touch screen and GUI (Graphical User Interface) provides improved operability. In addition, processing and equipment status are displayed on-screen and each operation can be performed just by touching the icons. Thus, high operability during processing and maintenance is achieved.
|Wafer Diameter||-||Φ300 mm
( Φ200, 300 mm with universal chuck table use)
|Grinding Method||-||Anomalous In-feed grinding with wafer rotation|
|Grinding Wheels||-||Φ300 mm Diamond Wheel|
|Spindle||Output||kW||4.8||Revolution speed range||min‐1||1,000 ～ 4,000|
|Machine dimensions (W × D × H)||mm||1,400 × 3,322 × 1,800|
*Product appearance, features, specifications, and other details may change due to technical
*Please read the standard specification sheet thoroughly before use.
|Machine dimentions（W × D × H）|