DAG811 is the next-generation model to DAG810, featuring a single-axis, single-chuck table configuration. It accommodates workpieces up to Φ8 inches (200 mm) in diameter, and supports Φ300 mm workpieces as an optional specification.
Incorporating DISCO’s new design concept, the operation screen size has been enlarged from 10.4 inches to 15 inches, doubling the display area for improved visibility and usability.
Furthermore, the optional motorized fine-adjustment axis allows on-screen wafer shape correction.
During wheel replacement, the spindle can be raised above the water case, allowing operators to perform replacement without reaching inside the case.
This simplifies maintenance and prevents contamination of cleanroom wear.
By reducing the equipment depth by 200 mm compared to the previous model, the footprint has been reduced by approximately 12 %, making DAG811 the first DISCO grinder with a floor area of less than 1 m2.
| Specification | Unit | ||
|---|---|---|---|
| Supported workpiece size | - | Φ8 inches (Φ4, 5, 6, 8 inches when using a universal chuck table) |
|
| Grinding method | - | In-feed grinding or Creep-feed grinding | |
| Grinding wheels | - | Φ200 mm diamond wheel | |
| Spindle | Rated output | kW | 4.2 |
| Rated torque | N・m | 5.7 | |
| Rotation speed range | min‐1 | 1,000 - 7,000 (Rated speed:7,000) | |
| Equipment dimensions(W × D × H) | mm | 600 × 1,500 × 1,800 | |
| Equipment weight | kg | Approx.1,600 | |
*Product appearance, features, specifications, and other details may change due to technical modifications.
*Please read the standard specification sheet thoroughly before use.
| Machine type |
| Spindle |
| C/T |
| Machine dimentions(W × D × H) |
| Machine weight(kg) |
Please feel free to contact us with any questions or inquiries.