Ultrasonic-wave processing aims to achieve good processing quality and high speed dicing of difficult-to-cut materials as typified by SiC (silicon carbide), glass and alumina ceramics.
Transmitting ultrasonic-wave oscillations to the blade improves water circulation at the processing point (elimination of clogging caused by the cutting dust discharge effect and cooling of the processing point) and promotes self-sharpening of the blade (elimination of blade glazing). Thus, normal blade condition can be maintained and process load can be reduced making highly efficient dicing possible.
Since this unit can be retrofitted to already shipped dicing saws, introducing ultrasonic-wave applications to your production line is a simple process. In addition, normal blades can be used even after the retrofit.
High feed speed and good processing quality can be realized
|Workpiece||0.35 mm thick 4H-SiC wafer|
|Blade||50 μm thick U09ZA- SD1500|
|Feed speed||10 mm/s 1Pass|
Greatly improved chipping and reduced street widths are realized by using the #2000 grit size, which previously could not be used.
|Workpiece||0.3 mm thick borocillicate glass|
|Blade||50 μm thick U09ZD- SD2000|
|Feed speed||3 mm/s 1Pass|