Newly Developed Die Inspection Unit DIS100
Achieves Fully Automatic Quality Management After Dicing

DISCO Corporation (Head Office: Ota-ku in Tokyo; President: Kazuma Sekiya), a semiconductor manufacturing equipment manufacturer, has developed DIS100, a unit that picks up die from the wafer after dicing and measures die thickness, chipping, backside surface roughness, and die strength* fully automatically. Efficient and highly accurate measurement is achieved by automating all of the existing manual processes.
In addition, DIS100 records measurement data. Therefore, it also improves traceability, as required in quality audits of automotive devices.

* Die strength
The largest stress when the die is bent until it breaks. The higher the die strength is, the less die breakage occurs, which contributes to improved yield and reliability for the final devices.


R&D Background

From a safety perspective, quality management is especially important for automotive devices, for which demand is increasing due to the development of self-driving and electric vehicles. In addition, high die strength is required for die used in memory devices, which are continually becoming thinner with storage capacity becoming larger.
Because there was no equipment to automatically measure die thickness, chipping, backside surface roughness, or die strength, there were issues caused by manual operation, including measurement variation and high inspection labor costs.
DIS100 achieves stable fully automatic die strength measurement and efficient die quality management.

DIS100 Product Features

Fully automatic inspection from die pick up to die strength measurement

After the user simply sets a frame cassette to DIS100 after dicing, DIS100 automatically picks up the designated die, measures die thickness, chipping**, backside surface roughness, and die strength (breakage test), and monitors the conditions when the die breaks using a high-speed camera***.

DIS100 Work Flow

DIS100 Work Flow

  1. Sets cassette
  2. Picks up die
  3. Sidewall inspection: thickness measurement, chipping measurement**
  4. Backside inspection: surface roughness measurement**
  5. Die strength measurement and condition monitoring using a high-speed camera***

UNITRAY Specification** for storing die after inspection

At automotive device manufacturers, demand is increasing for die storage in addition to quality recording for improved traceability.
DISCO UNITRAY specification achieves compact storage by placing the designated die on a UNITRAY, specially developed by DISCO, after sidewall and backside measurement.
Management information, including wafer lot number, is converted into a bar code so that die can be managed through tray labeling. It is possible to access the die data easily by scanning the bar code.

UNITRAY Specification for storing die after inspection

DIS100 UNITRAY Specification Work Flow

  1. Sets cassette
  2. Picks up die
  3. Sidewall inspection: thickness measurement, chipping measurement**
  4. Backside inspection: surface roughness measurement**
  5. Transfers die on UNITRAY
  6. Prints bar code with die information for labeling** UNITRAY

What is UNITRAY?

UNITRAY is a tray for IC chips that was designed by DISCO. Its dimensions are equal to those of the JEDEC tray.
The weak adhesive gel sheet attached on the entire surface of a UNITRAY secures the die. It can be used repeatedly upon cleaning.


DIS100 Functions

Die sidewall measurement**

Die sidewall measurement

Thickness measurement
(resolution: 0.2 μm)
Chipping measurement on front/backside surface
(width: 1 μm or more)

Die backside measurement (white-light interferometry)**

Die backside measurement (white-light interferometry)

Surface roughness measurement on ground surface

Die strength measurement using three-point bending

Die strength measurement using three-point bending

Breakage monitoring using high-speed camera***

Frame rate: 400,000 frames/s
(Max. rate: 2,000,000 frames/s)

** Optional
*** User-specified

Equipment Display

  1. Measurement data by die
  2. Intensity mapping display
  3. Graph of load until breakage
  4. Sidewall measurement image
  5. Backside measurement image
  6. Output measurement data in CSV format

Future Schedule

Panel and video exhibition at SEMICON Japan Virtual

  • Live streaming: December 14 (Monday)–17 (Thursday), 2020
  • On-demand streaming: December 11 (Friday), 2020–January 15 (Friday), 2021


Available for purchase

About DISCO Corporation
DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools (blades and wheels) used for manufacturing semiconductors and electrical components. In addition to these products, as a result of pursuing optimal processing results for customers through the provision of the technology used in the equipment and tools, DISCO products and processing technologies have been widely adopted by device manufacturers and semiconductor subcontractors domestically and internationally. For details, please view the DISCO website


Please feel free to contact us with any questions or inquiries.