DISCO has Acquired Letters of Compliance for IATF 16949, a Quality Management System for the Automotive Sector, for All Major Precision Processing Tool Products

DISCO Corporation (Headquarters: Ota-ku, Tokyo; President: Kazuma Sekiya), a semiconductor processing equipment manufacturer, has internally developed and implemented a quality management system that is in compliance with IATF 16949, a strict international standard specialized for the automotive sector, for all major precision processing tool*1 products manufactured in Hiroshima Works Kure Plant and Kuwabata Plant, and has acquired respective Letters of Compliance for IATF 16949.

About IATF 16949 and Letter of Compliance

IATF 16949 is an international standard for a quality management system that is to be applied throughout the automotive supply chain. IATF 16949 is a strict supplemental standard that is used in conjunction with ISO 9001, and requirements that are specialized for the automotive industry, such as safety and reliability, have been added. The IATF 16949 is for manufacturers that provide parts and materials for automotive purposes. Companies outside the automotive industry, including DISCO, are able to acquire a Letter of Compliance by using a private certification system that is independently conducted by an examination organization. As the examination scheme for private certification is the same as the scheme for IATF 16949, acquisition of a Letter of Compliance is proof that a quality management system that is equivalent to IATF 16949 is being implemented.

Background and Purpose behind Acquiring IATF 16949 Letters of Compliance

Due to the expansion and development of EV and self-driving technologies, the number of automotive semiconductors that are manufactured is increasing year by year. As the performance of automotive semiconductors and their materials could have an impact on the user’s life, high reliability is required. Under these circumstances, demands for strict quality management have been increasing for DISCO as well, as our precision processing tools come directly into contact with the workpieces (wafers and packages) as part of the manufacturing process for automotive semiconductors.
Moving forward, it is expected that the demand for higher levels of quality management will further increase not only for automotive semiconductors, but also for various advanced semiconductor device manufacturing processes. Therefore, DISCO believes that implementing a quality management system that is in compliance with IATF 16949 will lead to a stable supply of products that are higher in quality and have added value in the future.

History of Acquiring Letters of Compliance

Since the acquisition of ISO 9001 in August 1995, DISCO has promoted activities with the aim of establishing a good quality management system, and acquired a Letter of Compliance for ISO/TS 16949*2, which is the predecessor standard of IATF 16949, for some precision processing tool products on November 24, 2014. The reason for this is that at the time, there was an increased demand for automotive semiconductors from customers. In the following years, DISCO gradually expanded our range of compliant products, and acquired IATF 16949 Letters of Compliance for all major precision processing tool products manufactured in Hiroshima Works Kure Plant and Kuwabata Plant on February 28, 2022.

*1: Consumables that need to be replaced on a daily basis, including dicing blades, grinding wheels, and dry polishing wheels. They are installed on precision processing equipment and used in semiconductor manufacturing.
*2: ISO/TS 16949 transitioned to IATF 16949 in 2017.

(Added on April 6, 2022)
Due to a decision made by the examination organization, the Letters of Compliance service for IATF 16949 has been abolished. For details regarding DISCO’s response, please refer to the news release announced on April 6, 2022.

About DISCO Corporation
DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools (blades and wheels) used for manufacturing semiconductors and electrical components. In addition to these products, as a result of pursuing optimal processing results for customers through the provision of the technology used in the equipment and tools, DISCO products and processing technologies have been widely adopted by device manufacturers and semiconductor subcontractors domestically and internationally. For details, please view the DISCO website www.disco.co.jp.


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