Haneda R&D Center Opens, Strengthening R&D

DISCO Corporation, a semiconductor equipment manufacturer (Head Office: Ota-ku, Tokyo; President: Kazuma Sekiya), has acquired real estate in Higashikojiya, Ota-ku, Tokyo (land with building: former ANA Training Center / Business Center Building) from ANA HOLDINGS INC. (Head Office: Minato-ku, Tokyo) based on a real estate purchase agreement concluded on December 6, 2021.
DISCO will begin using this real estate as the Haneda R&D Center on April 1, 2022. This acquisition will further strengthen R&D and will support the high demand in the semiconductor and electronic components markets in the future.


1. Strengthening R&D

Due to further spread of AI/IoT and next-generation communication technology, advances in self-driving technology, and demands related to carbon neutrality, expansion of the semiconductor and electronic components markets in the mid-to-long term is expected. For this reason, the R&D Center at DISCO’s Head Office (Omori-Kita, Ota-ku, Tokyo) is operating close to full capacity as DISCO technology experiences an increase in demand and in the number of R&D projects. With the opening of the Haneda R&D Center, the floor space dedicated to R&D across all affiliate offices will be 2.2 times greater than previously, enabling the establishment of a system that can flexibly respond to diverse development needs.

2. Strengthening Production Systems

DISCO has established Kure Plant and Kuwabata Plant, Hiroshima Works (both in Kure City, Hiroshima Prefecture) and Chino Plant, Nagano Works (Chino City, Nagano Prefecture) as production sites while product development is mainly carried out at the R&D Center, Head Office. While up until this point the production sites have conduced verifications in preparation for mass production of new products, the opening of the Haneda R&D Center will allow these verifications to be conducted at this R&D location. In addition, while a large number of employees from the Head Office go to work at the production sites in Hiroshima and Nagano as support during periods of high demand such as the present, going forward, these employees will be able to provide support while still in Tokyo with utilization of the space in Haneda. With the opening of this new site, DISCO will be able to establish an even more stable production system.

Haneda R&D Center Overview

Name Haneda R&D Center, DISCO Corporation
Operation start April 1, 2022
Main purpose R&D for precision processing equipment, blades and wheels, and peripheral products/technologies
Address 7-56 Higashikojiya 6-chome, Ota-ku, Tokyo
Site area 32,321.89 m²
Structure 7 buildings in total (highest floor: 11th)
Total floor space 63,008.53 m²(7 buildings in total)
Real estate acquisition date March 31, 2022
Acquisition amount Approximately JPY 28B (full amount self-financed*)
*The acquisition amount at the time of acquisition was less than 30% of the consolidated net assets at the end of the last consolidated fiscal year (FY2020). Thus, the impact of the acquisition of this fixed asset on the full-year results for March 2022 (FY2021) is insignificant.

Reference 1. Overview of existing R&D Center, Head Office

Name R&D Center, Japan Head Office, DISCO Corporation
Address 13-11 Omori-Kita 2-chome, Ota-ku, Tokyo
Site area 11,570.54 m²
Total floor space 52,760.27 m² (Buildings A and B combined)
Completion Building A: November 2004
Building B: November 2008

Reference 2. Previous owner and acquired building

Company name ANA HOLDINGS INC.
Building name Former ANA Training Center / Business Center Building

About DISCO Corporation
DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools (blades and wheels) used for manufacturing semiconductors and electrical components. In addition to these products, as a result of pursuing optimal processing results for customers through the provision of the technology used in the equipment and tools, DISCO products and processing technologies have been widely adopted by device manufacturers and semiconductor subcontractors domestically and internationally. For details, please view the DISCO website www.disco.co.jp.


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