DISCO Corporation (Head Office: Ota-ku, Tokyo; President Kazuma Sekiya) has developed DFD6561: a fully-automatic dicing saw which supports ø300 mm wafers. This equipment will be exhibited in SEMICON Japan 2017 held at Tokyo Big Sight from December 13 to 15.
In the production of logic and memory which are installed in many electronic devices such as smartphones and servers, ø300 mm silicon wafers are used, and demand is likely to increase in the future, especially in Asia. In the mass production factories of the semiconductor back-end process, in order to line-up many ø300 mm fully-automatic dicing saws, space-saving measures are required. Thus, DISCO started to sell DFD6560 in 2012 to support these needs. This time, we conducted minor changes to DFD6560 for the purpose of further increasing productivity and processing quality.
|| Exhibited in SEMICON Japan 2017
||Start of sales