Osaka Branch Office Relocation with Completion of New Building

DISCO Corporation, a semiconductor manufacturing equipment manufacturer (Head Office: Ota-ku, Tokyo; President: Kazuma Sekiya), completed construction of and relocated its Osaka Branch Office to a new building on November 15, 2023. Operations at this location will begin February 5, 2024.

Reason for Relocation to New Building

With its many electronic components and semiconductor manufacturers, the Kansai region is expected to generate high demand for DISCO technologies going forward as well, driven by the development of next-generation communication and self-driving technologies along with the need for carbon neutrality. In order to better provide extensive support for customer demands in this region, the Osaka Branch Office was relocated to a newly constructed building.

Overview of New Osaka Branch Office Building

  • Improved support for test cuts and KKM services with expansion of clean room floor space to 3x that of the old office
  • Improved BCM* responsiveness through adoption of a seismically isolated structure and solar power system
  • Expecting to increase the ratio of clean rooms as business expands
  • *BCM: Business Continuity Management

    Osaka Branch Office Exterior

    Address 3-16, 3 chome, Semba Higashi, Minoh-shi, Osaka
    Site area 2205.98 m²
    Building structure Six-story steel-framed building (seismically isolated structure)
    Total floor space 8634.60 m² **
    Total investment JPY 4.28B (land: JPY 1.85B + construction: JPY 2.43B)
    Construction start September 8, 2022
    November 15, 2023

    **Total floor space of the old office was approx. 1,370 m²

    About DISCO
    DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools (blades and wheels) used for manufacturing semiconductors and electronic components. In addition to these products, as a result of pursuing optimal processing results for customers through the provision of the technology used with the equipment and tools, DISCO products and processing technologies have been widely adopted by device manufacturers and semiconductor subcontractors both domestically and internationally. For details, please visit the DISCO website at


    Please feel free to contact us with any questions or inquiries.