DISCO Corporation (Head Office: Ota-ku, Tokyo; President: Kazuma Sekiya) has developed a stealth dicing (SD)*1 laser saw DFL7362 which supports Φ300 mm wafers. DFL7362 achieves the high-throughput processing of thin Si wafers by reducing the workpiece transfer time due to improvements to the platform and the processing axis speed. Furthermore, DFL7362 can be equipped with a wide range of optional functions which achieve both high processing-quality and high productivity, such as dual-use wafer and frame transferring, and kerf checks during processing. DFL7362 will be exhibited in SEMICON Japan 2017 held at Tokyo Big Sight from December 13 to 15.
In recent years, with the widespread use of smartphones in Asia and growing needs for higher capacity and higher operation-speed storage and servers, the demand for flash memory is increasing. With flash memory, in order to stack die in the limited packaging space, it is necessary to cut out high-quality, thin die from the wafer. In order to meet these needs, DISCO provided the SDBG (Stealth Dicing Before Grinding) process*2 through DFL7361, which is already being used by many memory manufacturers throughout the world. The development of DFL7362 enables 30 % throughput improvement compared to the previous model and supports upgraded market needs.
Axis Operation Speed Comparison