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Corporate Outline

Course List

* If the training you request is not in the list, please contact your nearest DISCO affiliate office or agent.
* Most Operation trainings are offered by DISCO affiliate office or agent.
* For training fees, please contact a DISCO affiliate office or agent for a quotation.

  • If you would like to learn the full set of operation skills, please attend both Operation 1 and Operation 2 of the new course composition.
  • Content may differ depending on the course. Please contact a DISCO affiliate office or agent for details.
  • Equipment with certain features/user-specifications may not be available at the Training Center. The trainer will give additional explanations verbally, without training materials.
  • We may not be able to conduct training for the content shown below.
    1. Customer special specifiation parts
    2. Maintenance tasks that can only be performed by a DISCO engineer
    3. Operation training using customer products

Dicing Saw / Laser Saw

*Course capacity ranges from 2 to 4 trainees depending on the equipment model and the course. Please contact us for details.

Operation 1 Operation 2 Maintenance 1 Maintenance 2
Course Objective To enable trainees to understand the terms necessary for operating the equipment and to process products by calling up data sets in the equipment To enable trainees to create and set data, and to set up the functions for operating the equipment To enable trainees to precisely and safely perform periodic maintenance and replacement of consumable parts as described in the Maintenance Manual of the equipment To enable trainees to conduct maintenance tasks which are not described in the Maintenance Manual of the equipment (only items that can be executed without the use of any special tools or access to internal maker data)
Main Course Topics
*Topics may differ depending on the equipment type 		・Equipment Overview
・Important Safety Information
・Equipment Start-up and Termination
・Workpiece Cutting 		・Manage and Edit Device Data
・Alignment Teach
・Blade Replacement…Only for Dicing Saws 		・Inspection Items
・Greasing
・Consumable Part Replacement
・Backing Up Machine Data
・Wheel Mount/Flange Conditioning…Only for Dicing Saws 		・Equipment Structure (Electrical Components, Safety Interlock Circuits)
・Equipment Part Replacement
・Accuracy Inspection…Only for applicable Dicing Saws
DAD3220
DAD3230
DAD3350
DAD3430
DAD3650 		1 day 1.5 days 2 days 2 days
1.5 days
(Measurement Alignment Package)
DAD3221
DAD3231
DAD3241
DAD3351
DAD3361
DAD3660
DAD3661 		1 day 1.5 days 2 days 1 day
1.5 days
(Measurement Alignment Package)
DFD6340
DFD6341
DFD6360
DFD6361 		1 day 2 days 2 days 2 days
2 days
(Measurement Alignment Package)
1 day
(Half-cut Specification) 		2 days
(Half-cut Specification) 		3 days
(Half-cut Specification) 		3 days
(Half-cut Specification)
DFD6362 1 day 2 days 2 days 1 day
2 days
(Measurement Alignment Package)
DFD6363
DFD6363 2way 		1 day 2 days 2 days -
DFD6560
DFD6561 		1 day 2 days 2 days 1 day
DFD6750 1 day 2 days 2 days 3 days
DFL7160 1 day 1 day 2 days 1 day
DFL7161 1 day 1 day 2 days 1.5 days
1 day
(BSS6 Specification) 		3.5 days
(BSS6 Specification)
DFL7262 1 day 1.5 days 2 days -
DFL7361
DFL7362 		1 day 1 day 2 days -

Grinder / Surface Planer

*Course capacity ranges from 2 to 4 trainees depending on the equipment model and the course. Please contact us for details.

Operation 1 Operation 2 Maintenance 1 Maintenance 2
Course Objective To enable trainees to understand the terms necessary for operating the equipment and to process products by calling up data sets in the equipment To enable trainees to create and set data, and to set up the functions for operating the equipment To enable trainees to precisely and safely perform periodic maintenance and replacement of consumable parts as described in the Maintenance Manual of the equipment To enable trainees to conduct maintenance tasks which are not described in the Maintenance Manual of the equipment (only items that can be executed without the use of any special tools or access to internal maker data)
Main Course Topics
*Topics may differ depending on the equipment type 		・Equipment Overview
・Important Safety Information
・Initialization
・Warmup
・Workpiece Grinding 		・Managing and Editing Recipe Data
・Wheel Replacement
・Setup Procedures
・Dressing 		・Inspection Items
・Greasing
・Consumable Part Replacement
・File Management and Log Data 		・Self Grinding
・Adjustment (Transfer, Robot etc.)
・Equipment Structure (Piping, Electrical Components)
DFG8540 0.5 days 1 day 1.5 days 3 days
DGP8760 0.5 days 1.5 days 1.5 days 3 days
DGP8761 0.5 days 1.5 days 1.5 days 3.5 days
DFS8910 0.5 days 1 day 1.5 days 1 day

If considering MUSUBI training: Choose the MUSUBI category

Mounter / Die Separator / Accessory Equipment

*Course capacity ranges from 2 to 4 trainees depending on the equipment model and the course. Please contact us for details.

Operation 1 Operation 2 Maintenance 1 Maintenance 2
Course Objective To enable trainees to understand the terms necessary for operating the equipment and to process products by calling up data sets in the equipment To enable trainees to create and set data, and to set up the functions for operating the equipment To enable trainees to precisely and safely perform periodic maintenance and replacement of consumable parts as described in the Maintenance Manual of the equipment To enable trainees to conduct maintenance tasks which are not described in the Maintenance Manual of the equipment (only items that can be executed without the use of any special tools or access to internal maker data)
DFM2800 0.5 days 1 day 1.5 days 3 days
DDS2300 1 day 1 day 2 days -
DWR1722 Inquire - 1 day -

If considering MUSUBI training: Choose the MUSUBI category

MUSUBI

*Course capacity ranges from 2 to 4 trainees depending on the equipment model and the course. Please contact us for details.

Operation 1 Operation 2 Maintenance 1
Course Objective To enable trainees to understand the terms necessary for operating the equipment and to process products by calling up data sets in the equipment To enable trainees to create and set data, and to set up the functions for operating the equipment To enable trainees to precisely and safely perform periodic maintenance and replacement of consumable parts as described in the Maintenance Manual of the equipment
DMG8762 0.5 days 1.5 days 1.5 days
DMM9200 0.5 days 1.5 days 1.5 days
MUSUBI transfer section 0.5 days 1 day 1.5 days
MUSUBI metrology unit 0.5 days 0.5 days

Equipment/units for which training can be provided by the Global Training Department are DMG8762, DMM9200, MUSUBI transfer section, and metrology unit

The number of days taken for training may change depending on the selected course(s).

Option

Practical skills
Classroom learning

* The courses are available only for those who take Operation, Maintenance 1, Maintenance 2 or Tier 1 - 3 courses. (Regardless to the type of equipment)
* Applications for the optional courses alone will not be accepted.
* The end time on the first day of the training will change according to the hours needed for the optional course.
Please contact us for any inconveniences.

Lecture + factory tour

Classroom learning

  • Classroom learning + factory tour (Dicing Saw)

    This course provides classroom seminars on topics such as blade basics and optional functions of Dicing Saws, in addition to a tour of the equipment manufacturing site at Kuwabata Plant.
    Time: 1 p.m. to 4 p.m.
    Note: Please come directly to Kuwabata Plant on the day of the course.

Process Introduction by Device

Latest Processing Technologies in Wafer Level Package Manufacturing
  • 2.5hours

    The wafer level packaging (WLP) manufacturing process is gradually recapturing attention in recent years. In this seminar, we introduce the latest Kiru, Kezuru, and Migaku processing technologies in the WLP manufacturing process, and discuss the latest topics, from basic technologies, to warpage countermeasures for wafer thinning and challenges in Low-k processing.

Latest Thinning Technologies in Memory Production
  • 1hour

    In this seminar, we introduce the latest processing technologies in memory production, focusing on the NAND thinning process, which drives the wafer ultra-thinning market, and discuss the latest topics, from basic technologies, to the DBG and SDBG processes used in mass production.

Latest Thinning Technologies in Power Device Manufacturing
  • 1hour

    Power devices are widely used in diversified equipment and are also becoming popular in saving energy and reducing CO2 emissions. In this seminar, we introduce the latest processing technologies in power device manufacturing, and discuss the latest topics, from basic market information, to SiC power devices.