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Dai-Ichi Seitosyo when it was
founded (Kure City)
In 1937 Kure City, Hiroshima, industrial blade and wheel manufacturers were crowded around the Kure Naval Arsenal which was responsible for the construction and development of warships and weapons. Mitsuo Sekiya who had returned home from Manchuria saw this as an opportunity and founded the “Dai-ichi Seitosyo”. However, as a later manufacturer, orders from the naval arsenal were not received as planned, and Osaka, where he had focused his sales activities continued to request severe price decreases. Knowing that “We won’t survive at this rate”, he established an office in Kanda, Tokyo, and began to sell to private sector corporations on his own. It was the first turning point in the four years since the company was established.

The second turning point came in 1941, the year following the expansion to Tokyo. It was the acquisition of a company which manufactured grinding wheels for grinding and polishing small parts. Taking advantage of the acquisition, focus was placed on precision grinding wheels, and the production of the resinoid abrasive wheel using a new manufacturing method was successful. This new method could produce very thin grinding wheels, which made it possible for them to be used for precision cutting.

The newly developed 1.2 millimeter thickness high precision resinoid wheel rode the housing boom of the post-war recovery by finding widespread adoption for the grinding of the edges of magnetic discs used as an part for watt-hour meters in homes. Taking advantage of DISCO’s track record, in 1956, by the request of a large scale fountain pen manufacturer, a new 0.14 millimeter ultra-thin blade was developed to cut the tips of fountain pens. DISCO obtained 100% market share in this market segment. Subsequently, the grinding wheel developed for fountain pens was thinned to 0.1 millimeters and found widening applications, including the processing of electronic parts.

In 1967, one salesman brought about the next turning point for DISCO. He obtained information regarding how “if a blade that was half as thick as the blade used for fountain pens (70 micro meters) could be made, it would find applications in the cutting of semiconductors.” One year later, the 40 micrometer ultra-thin resinoid dicing blade (MICRON-CUT) was successfully developed, and DISCO and the semiconductor industry continued into the future full steam ahead.
Story 2: Greeting the world with a new name, DISCO!

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