Development of DFG8561: A Fully Automatic Grinder Supporting Φ300 mm Wafers
DISCO CORPORATION, a semiconductor manufacturing equipment manufacturer (Head Office: Ota-ku, Tokyo; President: Kazuma Sekiya), has developed DFG8561, a fully automatic grinder that supports Φ300 mm wafers.
This equipment will be exhibited at SEMICON Japan 2025 (December 17-19, Tokyo Big Sight).
Developmental Background
In the semiconductor back-end/OSAT industry, wafer thinning (grinding) has become a standard process to achieve a low profile and higher integration. In addition, migration from 5-/6-inch to 8-inch and 300 mm wafers is accelerating in order to improve production efficiency for automotive and home-appliance MCUs, analog ICs, and sensors. To address these thinning needs, DISCO has developed DFG8561, a next-generation grinder that supports 300 mm wafers.
Features
- Improved wafer thickness accuracy Through improvements such as adoption of a rotation axis with low vibration and low thermal expansion on the wafer retaining table, the thickness accuracy within the wafer and between wafers has been improved.
- Compatible with a wide range of materials Installed with a high-power spindle (6.3 kW), enabling processing of difficult-to-grind materials such as SiC and sapphire.
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Improved productivity
- Processing time reduced by optimizing the transfer/cleaning mechanism, making the productivity 1.6x higher compared to the conventional model.
- With a built-in vacuum unit, the footprint is reduced by 12% compared to the conventional model, improving the productivity per unit floor area.
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Improved usability
- The processing recipe can be configured for each wafer in the same cassette, enabling multi-variety low-volume production.
- Main types of data are displayed as graphs on a large, 19-inch monitor.
Future Schedule
| To be exhibited at SEMICON Japan 2025 | December 17 to 19, 2025 at Tokyo Big Sight |
|---|---|
| Test cuts | Accepting requests |
| Sales release | Accepting orders |
About DISCO
DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools (blades and wheels) used for manufacturing semiconductors and electronic components. In addition to these products, as a result of pursuing optimal processing results for customers through the provision of the technology used with the equipment and tools, DISCO products and processing technologies have been widely adopted by device manufacturers and semiconductor subcontractors both domestically and internationally. For details, please visit the DISCO website at www.disco.co.jp.
Contact
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