Development of DP26: Dry Polishing Wheels for Small-Die Devices
DISCO CORPORATION, a semiconductor manufacturing equipment manufacturer (Head Office: Ota-ku, Tokyo; President: Kazuma Sekiya), has developed DP26, dry polishing wheels for small-die devices.
This equipment will be exhibited at SEMICON Japan 2025 (December 17-19, Tokyo Big Sight).
Developmental Background
In semiconductor memory manufacturing, achieving both wafer thinning and high mechanical strength is essential as packages move to a low profile, and the DBG process is widely adopted. In recent years, further thinning has been pursued not only for memory but also for small-die devices such as RFID. Used alongside DBG, demand is rising for dry polishing (DP) to remove post-thinning damage. Because conventional DP wheels struggled with post-DBG polishing on small-die wafers, DISCO has developed DP26 to specifically support these applications.
Features
- Supports small-die devices Achieves stable processing of approx. 1mm x 1mm small die while maintaining the die strength after processing using the pad manufactured with an improved design and materials.
- Achieves stable wafer removal amount As the removal amount during polishing is more stable compared to the conventional product, DP26 contributes to reduction of TTV within the wafer.
Future Schedule
| To be exhibited at SEMICON Japan 2025 | December 17 to 19, 2025 at Tokyo Big Sight |
|---|---|
| Test cuts | Accepting requests |
| Sales release | Accepting orders |
About DISCO
DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools (blades and wheels) used for manufacturing semiconductors and electronic components. In addition to these products, as a result of pursuing optimal processing results for customers through the provision of the technology used with the equipment and tools, DISCO products and processing technologies have been widely adopted by device manufacturers and semiconductor subcontractors both domestically and internationally. For details, please visit the DISCO website at www.disco.co.jp.
Contact
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