Development of DFD6080: A Dicing Saw for Package Dicing (Max. 400 x 400 mm)
DISCO CORPORATION, a semiconductor manufacturing equipment manufacturer (Head Office: Ota-ku, Tokyo; President: Kazuma Sekiya), has developed DFD6080, a fully automatic dicing saw that enables package dicing of max. 400 x 400 mm packages.
This equipment will be exhibited at SEMICON Japan 2025 (December 17-19, Tokyo Big Sight).
Developmental Background
With the spread of AI and the advance of DX, demand for semiconductor products continues to grow. To improve productivity, fan-out wafer-level packaging (FOWLP), which uses a 300 mm wafer as a carrier, has become widespread. To further improve efficiency, development of panel-level packaging (PLP) using large panels is progressing.
DISCO released DFD6310, a dicing saw for large panels (up to 720 x 610 mm) in 2016, and to respond to a wider range of applications, we have now developed DFD6080, which can process workpieces up to 400 x 400 mm.
Features
- Supports dicing of packages with a maximum size of 400 x 400 mm
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Improved efficiency with multiple-mounted
workpiece processing
Achieves improved productivity and cost reduction by mounting multiple strip substrates on one frame and performing singulation
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Supports dicing of a wide range of materials and composite materials including resin substrates, glass substrates, and lead frames
- 1.8 kW high-power spindle (installed as a standard specification)
- Sub-chuck table that enables dressing during processing (installed as a standard specification)
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Installed with a large capacity ABC (Automatic Blade Changer) (option)
- Adopts a blade stocker that enables easy blade stocking and retrieval
- Possible to stock more than 80 hub blades and 200 hubless blades
Future Schedule
| To be exhibited at SEMICON Japan 2025 | December 17 to 19, 2025 at Tokyo Big Sight |
|---|---|
| Test cuts | Accepting requests |
| Sales release | From the second half of 2026 |
About DISCO
DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools (blades and wheels) used for manufacturing semiconductors and electronic components. In addition to these products, as a result of pursuing optimal processing results for customers through the provision of the technology used with the equipment and tools, DISCO products and processing technologies have been widely adopted by device manufacturers and semiconductor subcontractors both domestically and internationally. For details, please visit the DISCO website at www.disco.co.jp.
Contact
Please feel free to contact us with any questions or inquiries.