Development of Three Laser Saws: DFL7162, DFL7363, DFL7563
DISCO CORPORATION, a semiconductor manufacturing equipment manufacturer (Head Office: Ota-ku, Tokyo; President: Kazuma Sekiya), has developed three types of laser saws, DFL7162, DFL7363, and DFL7563, in order to respond to diversifying back-end process applications.
These models will be exhibited at SEMICON Japan 2025 (December 17-19, Tokyo Big Sight).
Developmental Background
In the dicing process, where semiconductor wafers are cut and separated, blade dicing using abrasives (blades) has been the mainstream method since the 1970s. However, since the 2000s, devices that are difficult to process have emerged, such as logic devices with mechanically weak low-k dielectric films and MEMS devices that form fine structures on the wafer. To address these processing challenges, adoption of laser dicing as a complementary method has been increasing.
To address increasingly diverse semiconductor devices and their manufacturing processes, DISCO has developed three laser saw models, namely DFL7162, DFL7363, and DFL7563.
Features of Each Model
DFL7162
Supports 300 mm workpieces, ablation laser saw
- Enhanced productivity due to optimization of the internal layout and installation of two load ports
- Possible to install the laser head and optical system for the grooving and full-cut processes, supporting processing of various materials
- Supports both wafer and frame transfer*
Test cuts: Accepting requests / Sales release: Planned around April 2027
DFL7363
Supports 300 mm workpieces, Stealth Dicing™ laser saw
- Productivity increased by approximately 50% compared to the conventional model due to two chuck tables and installation of a high-power engine
- Processing and measurement/inspection can be performed simultaneously on separate chuck tables
- Processing quality inspection can be performed inside the equipment*
Test cuts: Please contact your DISCO sales representative / Sales release: Planned for the second half of FY2026
DFL7563
Supports 300 mm workpieces, ablation laser saw
- A high-speed and high-precision laser processing equipment that combines a scanning optical system and a moving stage
- Capable of processing complex shapes and curves
- Selectively removes the protective material, enabling application to maskless processes
Test cuts: Accepting requests / Sales release: Planned around January 2026
* Handled as optional specifications
About DISCO
DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools (blades and wheels) used for manufacturing semiconductors and electronic components. In addition to these products, as a result of pursuing optimal processing results for customers through the provision of the technology used with the equipment and tools, DISCO products and processing technologies have been widely adopted by device manufacturers and semiconductor subcontractors both domestically and internationally. For details, please visit the DISCO website at www.disco.co.jp.
Contact
Please feel free to contact us with any questions or inquiries.