DIS100DISCO Inspection System
Full Automation from Die Pick-Up to Die Strength Measurement
- Φ300 mm
Fully Automatic Die Inspection System
DIS100 automatically performs die pick-up from a tape frame, thickness and chipping measurement, backside roughness measurement, and die strength* measurement (destructive). Full automation minimizes variations in die strength measurement caused by manual operation and enables efficient die quality control.
* Die strength: Maximum stress at die breakage during bending.
Workflow
- Cassette is set
- Alignment/Pick-up
-
Die observation：
Sidewall (Thickness, Chipping)
Backside (Roughness) - Die strength measurement: three-point bending test
Die strength measurement
Three-point bending test
Video of breakage
Sidewall measurement**
Thickness measurement
Front and backside chipping measurement
Backside measurement**
Ground surface roughness measurement
UNITRAY (DISCO’s Original IC Die Tray) Specification**
** Optional specifications
Workflow with UNITRAY Specification
- Cassette is set
- Alignment/Pick-up
- Die observation
- Die are moved to the UNITRAY
- Barcode label with die information is attached
- UNITRAY is unloaded
Die are stored in the UNITRAY without performing die strength measurement
** Optional specifications
Specifications
| Specification | Unit | DIS100 | |
|---|---|---|---|
| Supported tape frame size | mm | Φ200 / 300 | |
| Supported die size | - | 2 mm x 2 mm or larger | |
| Equipment dimensions （W x D x H） | mm | 1,300 × 1,300 × 1,800 | |
| Equipment weight | kg | Approx. 800 | |
* Please read the standard specification sheet before using the equipment.
* Please note that items and specifications may be changed for improvement without prior notice.
DIS100DISCO Inspection System
Contact
Please feel free to contact us with any questions or inquiries.