Application processing examples
Higher quality processing is now possible for 4-inch LT wafers used in SAW device substrates and other components.
The surface roughness values are approximately Ra: 0.002 µm, and Ry: 0.017 µm.
Conventional processed surface
High-quality processed surface
A free-of-charge test cut is performed at an application lab to confirm whether achieving the customer's needs is possible.
Dicing and Grinding Service
It is effective in sample and prototype manufacturing during development or low-volume production. Designated engineers will provide support based on the desired leadtime and at reasonable cost.