AutoTTV

AutoTTV is a function that automatically adjusts the inclination of the chuck table based on the wafer thickness obtained by the NCG (Non-Contact Gauge), thereby correcting wafer shape variations caused by grinding.

Process Flow

Regrind AutoTTV (Patented)

Regrind Regrind AutoTTV is a function that temporarily stops grinding at any desired thickness, measures the wafer shape, corrects the chuck table inclination, and then resumes grinding.
This enables shape correction of the same wafer through a regrinding process.

Process Flow

Advantages of Regrind AutoTTV

• Enables wafer shape correction starting from the very first wafer
• Applies optimal shape correction for each wafer, eliminating wafer-to-wafer TTV variation